Ceetak’s Profiled Die Heat sealing technology is specifically suitable for non-standard shapes, such as lid sealing for tray meals, sandwich boxes or yoghurt pots.
This technology incorporates highly conductive, small-section dies that heat up to operating temperature, and cool down (when switched off) quicker than traditional heat sealing methods.
The low mass heat energy eliminates the requirement for any water cooling and consistent, reliable seals are produced due to the stable weld temperature.
